해외주문
Electromagnetic Compatibility Engineering
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Wiley
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2009년 08월 01일
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- 해외주문도서는 고객님의 요청에 의해 주문하는 '개인 오더' 상품이기 때문에, 단순한 고객변심/착오로 인한 취소, 반품, 교환의 경우 '해외주문 반품/취소 수수료'를 부담하셔야 합니다. 이점 유의하여 주시기 바랍니다.
- 반품/취소 수수료:(1)서양도서-판매정가의 12%, (2)일본도서-판매정가의 7% (반품/취소 수수료는, 수입제반비용(FedEx수송비용, 관세사비, 보세창고료, 내륙 운송비, 통관비 등)과 재고리스크(미판매 리스크, 환차손)에 따른 비용을 포함하며, 서양도서는 판매정가의 12%, 일본도서는 판매정가의 7%가 적용됩니다.)
- 외국도서의 경우 해외제공정보로만 서비스되어 미표기가된 정보가 있을 수 있습니다. 필요한 정보가 있을경우 1:1 문의게시판 을 이용하여 주십시오.
Henry W. Ott is President and Principal Consultant of Henry Ott Consultants, an EMC/ESD training and consulting organization located in Livingston, New Jersey. Mr. Ott is considered by many to be the nation's leading EMC educator.
Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." -EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction'and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information-such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD-that made the previous book such a wide success, this new book includes additional coverage of: Equipment/systems grounding Switching power supplies and variable-speed motor drives Digital circuit power distribution and decoupling PCB layout and stack-up Mixed-signal PCB layout RF and transient immunity Power line disturbances Precompliance EMC measurements New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels.
This expanded third edition reflects the latest advances and developments in the field of electromagnetic compatibility engineering as well as containing everything in previous editions that is still valid. It demonstrates, amongst other new topics, how and why noise in electronic digital systems can be avoided or minimized.
Henry W. Ott is President and Principal Consultant of Henry Ott Consultants, an EMC/ESD training and consulting organization located in Livingston, New Jersey. Mr. Ott is considered by many to be the nation's leading EMC educator.
This expanded third edition of the most popular book on electromagnetic compatibility reflects all of the latest advances and developments in the field. It demonstrates how and why noise in electronic digital systems can be avoided or minimized. Although much will be added (including five new chapters) and updated in this edition, virtually everything that was in the second edition is still applicable and will remain in the third edition. This book is essential for design engineers in the electronics industry and students in EMC.
"This is an outstanding book. At 872 pages thick, it is a valuable follow-up to Ott's earlier books, Noise Reduction Techniques in Electronic Systems (first edition, 1975; second edition, 1987) . . . EMC will remain with us in the foreseeable future, and we need books like this one." (The Radio Science Bulletin, 1 June 2011)
This expanded third edition of the most popular book on electromagnetic compatibility reflects all of the latest advances and developments in the field. It demonstrates how and why noise in electronic digital systems can be avoided or minimized.
Praise for Noise Reduction Techniques IN electronic systems "Henry Ott has literally 'written the book' on the subject of EMC. . . . He not only knows the subject, but has the rare ability to communicate that knowledge to others." -EE Times Electromagnetic Compatibility Engineering is a completely revised, expanded, and updated version of Henry Ott's popular book Noise Reduction Techniques in Electronic Systems. It reflects the most recent developments in the field of electromagnetic compatibility (EMC) and noise reduction'and their practical applications to the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. While maintaining and updating the core information-such as cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD-that made the previous book such a wide success, this new book includes additional coverage of: Equipment/systems grounding Switching power supplies and variable-speed motor drives Digital circuit power distribution and decoupling PCB layout and stack-up Mixed-signal PCB layout RF and transient immunity Power line disturbances Precompliance EMC measurements New appendices on dipole antennae, the theory of partial inductance, and the ten most common EMC problems The concepts presented are applicable to analog and digital circuits operating from below audio frequencies to those in the GHz range. Throughout the book, an emphasis is placed on cost-effective EMC designs, with the amount and complexity of mathematics kept to the strictest minimum. Complemented with over 250 problems with answers, Electromagnetic Compatibility Engineering equips readers with the knowledge needed to design electronic equipment that is compatible with the electromagnetic environment and compliant with national and international EMC regulations. It is an essential resource for practicing engineers who face EMC and regulatory compliance issues and an ideal textbook for EE courses at the advanced undergraduate and graduate levels.
This expanded third edition reflects the latest advances and developments in the field of electromagnetic compatibility engineering as well as containing everything in previous editions that is still valid. It demonstrates, amongst other new topics, how and why noise in electronic digital systems can be avoided or minimized.
Henry W. Ott is President and Principal Consultant of Henry Ott Consultants, an EMC/ESD training and consulting organization located in Livingston, New Jersey. Mr. Ott is considered by many to be the nation's leading EMC educator.
This expanded third edition of the most popular book on electromagnetic compatibility reflects all of the latest advances and developments in the field. It demonstrates how and why noise in electronic digital systems can be avoided or minimized. Although much will be added (including five new chapters) and updated in this edition, virtually everything that was in the second edition is still applicable and will remain in the third edition. This book is essential for design engineers in the electronics industry and students in EMC.
"This is an outstanding book. At 872 pages thick, it is a valuable follow-up to Ott's earlier books, Noise Reduction Techniques in Electronic Systems (first edition, 1975; second edition, 1987) . . . EMC will remain with us in the foreseeable future, and we need books like this one." (The Radio Science Bulletin, 1 June 2011)
This expanded third edition of the most popular book on electromagnetic compatibility reflects all of the latest advances and developments in the field. It demonstrates how and why noise in electronic digital systems can be avoided or minimized.
원서번역서 내용 엿보기
EMC 분야 종사자를 위한 『EMC공학』 Part 2 《실무응용편》. 2009년 출간된 《Electromagnetic Compatibility Engineering》를 번역한 것이다. 저자가 20여 년간 EMC 기술에 대해 기업을 상대로 컨설팅과 교육 훈련을 하면서 얻은 경험을 바탕으로 삼고 있다. 디지털과 아날로그, 그리고 혼성신호 회로 설계와 관련한 EMC 이론과 그의 실제적 응용에 대해 다룬다.
작가정보
저자(글) Ott, Henry W.
목차
Preface p. xxiii EMC Theory p. 1 Electromagnetic Compatibility p. 3 Introduction p. 3 Noise and Interference p. 3 Designing for Electromagnetic Compatibility p. 4 Engineering Documentation and EMC p. 6 United States' EMC Regulations p. 6 FCC Regulations p. 6 FCC Part 15, Subpart B p. 8 Emissions p. 11 Administrative Procedures p. 14 Susceptibility p. 17 Medical Equipment p. 17 Telecom p. 18 Automotive p. 19 Canadian EMC Requirements p. 19 European Union's EMC Requirements p. 20 Emission Requirements p. 20 Harmonics and Flicker p. 22 Immunity Requirements p. 23 Directives and Standards p. 23 International Harmonization p. 26 p. 27 p. 28 The Regulatory Process p. 30 Typical Noise Path p. 30 Methods of Noise Coupling p. 31 Conductively Coupled Noise p. 31 Common Impedance Coupling p. 32 Electric and Magnetic Field Coupling p. 33 Miscellaneous Noise Sources p. 33 Galvanic Action p. 33 Electrolytic Action p. 35 Triboelectric Effect p. 35 Conductor Motion p. 36 Use of Network Theory p. 36 Summary p. 38 Problems p. 39 References p. 41 Further Reading p. 42 Cabling p. 44 Capacitive Coupling p. 45 Effect of Shield on Capacitive Coupling p. 48 Inductive Coupling p. 52 Mutual Inductance Calculations p. 54 Effect of Shield on Magnetic Coupling p. 56 Magnetic Coupling Between Shield and Inner Conductor p. 58 Magnetic Coupling-Open Wire to Shielded Conductor p. 61 Shielding to Prevent Magnetic Radiation p. 64 Shielding a Receptor Against Magnetic Fields p. 67 Common Impedance Shield Coupling p. 69 p. 70 p. 74 Shield Transfer Impedance p. 75 Coaxial Cable Versus Twisted Pair p. 75 Braided Shields p. 79 Spiral Shields p. 81 Shield Terminations p. 84 Pigtails p. 84 Grounding of Cable Shields p. 88 Ribbon Cables p. 94 Electrically Long Cables p. 96 Summary p. 96 Problems p. 98 References p. 103 Further Reading p. 104 Grounding p. 106 AC Power Distribution and Safety Grounds p. 107 Service Entrance p. 108 Branch Circuits p. 109 Noise Control p. 111 Earth Grounds p. 114 Isolated Grounds p. 116 Separately Derived Systems p. 118 Grounding Myths p. 119 Signal Grounds p. 120 Single-Point Ground Systems p. 124 Multipoint Ground Systems p. 126 Common Impedance Coupling p. 128 Hybrid Grounds p. 130 Chassis Grounds p. 131 Equipment/System Grounding p. 132 Isolated Systems p. 133 Clustered Systems p. 133 Distributed Systems p. 140 Ground Loops p. 142 Low-Frequency Analysis of Common-Mode Choke p. 147 High-Frequency Analysis of Common-Mode Choke p. 152 Single Ground Reference for a Circuit p. 154 Summary p. 155 Problems p. 156 References p. 157 Further Reading p. 157 Balancing and Filtering p. 158 Balancing p. 158 Common-Mode Rejection Ratio p. 161 Cable Balance p. 165 System Balance p. 166 Balanced Loads p. 166 Filtering p. 174 Common-Mode Filters p. 174 Parasitic Effects in Filters p. 177 Power Supply Decoupling p. 178 Low-Frequency Analog Circuit Decoupling p. 183 Amplifier Decoupling p. 185 Driving Capacitive Loads p. 186 System Bandwidth p. 188 Modulation and Coding p. 190 Summary p. 190 Problems p. 191 References p. 192 Further Reading p. 193 Passive Components p. 194 Capacitors p. 194 Electrolytic Capacitors p. 195 Film Capacitors p. 197 Mica and Ceramic Capacitors p. 198 Feed-Through Capacitors p. 200 Paralleling Capacitors p. 202 Inductors p. 203 Transformers p. 204 Resistors p. 206 Noise in Resistors p. 207 Conductors p. 208 Inductance of Round Conductors p. 209 Inductance of Rectangular Conductors p. 210 Resistance of Round Conductors p. 211 Resistance of Rectangular Conductors p. 213 Transmission Lines p. 215 Characteristic Impedance p. 217 Propagation Constant p. 220 High-Frequency Loss p. 221 Relationship Among C, L and ?. p. 224 Final Thoughts p. 225 Ferrites p. 225 Summary p. 233 Problems p. 234 References p. 237 Further Reading p. 237 Shielding p. 238 Near Fields and Far Fields p. 238 Characteristic and Wave Impedances p. 241 Shielding Effectiveness p. 243 Absorption Loss p. 245 Reflection Loss p. 249 Reflection Loss to Plane Waves p. 252 Reflection Loss in the Near Field p. 253 Electric Field Reflection Loss p. 254 Magnetic Field Reflection Loss p. 255 General Equations for Reflection Loss p. 256 Multiple Reflections in Thin Shields p. 256 Composite Absorption and Reflection Loss p. 257 Plane Waves p. 257 Electric Fields p. 258 Magnetic Fields p. 259 Summary of Shielding Equations p. 260 Shielding with Magnetic Materials p. 260 p. 265 p. 267 Multiple Apertures p. 270 Seams p. 273 Transfer Impedance p. 277 Waveguide Below Cutoff p. 280 Conductive Gaskets p. 282 Joints of Dissimilar Metals p. 283 Mounting of Conductive Gaskets p. 284 The "Ideal" Shield p. 287 Conductive Windows p. 288 Transparent Conductive Coatings p. 288 Wire Mesh Screens p. 289 Mounting of Windows p. 289 Conductive Coatings p. 289 Conductive Paints p. 291 Flame/Arc Spray p. 291 Vacuum Metalizing p. 291 Electroless Plating p. 292 Metal Foil Linings p. 292 Filled Plastic p. 293 Internal Shields p. 293 Cavity Resonance p. 295 Grounding of Shields p. 296 Summary p. 296 Problems p. 297 References p. 299 Further Reading p. 300 Contact Protection p. 302 Glow Discharges p. 302 Metal-Vapor or Arc Discharges p. 303 AC Versus DC Circuits p. 305 Contact Material p. 306 Contact Rating p. 306 Loads with High Inrush Currents p. 307 Inductive Loads p. 308 Contact Protection Fundamentals p. 310 p. 314 p. 318 C Network p. 318 R-C Network p. 318 R-C-D Network p. 321 Inductive Loads Controlled by a Transistor Switch p. 322 Resistive Load Contact Protection p. 323 Contact Protection Selection Guide p. 323 Examples p. 324 Summary p. 325 Problems p. 326 References p. 327 Further Reading p. 327 Intrinsic Noise Sources p. 328 Thermal Noise p. 328 Characteristics of Thermal Noise p. 332 Equivalent Noise Bandwidth p. 334 Shot Noise p. 337 Contact Noise p. 338 Popcorn Noise p. 339 Addition of Noise Voltages p. 340 Measuring Random Noise p. 341 Summary p. 342 Problems p. 343 References p. 345 Further Reading p. 345 Active Device Noise p. 346 Noise Factor p. 346 Measurement of Noise Factor p. 349 Single-Frequency Method p. 349 Noise Diode Method p. 350 Calculating S/N Ratio and Input Noise Voltage from Noise Factor p. 351 Noise Voltage and Current Model p. 353 Measurment of Vn and In p. 355 Calculating Noise Factor and S/N Radio from Vn-In p. 356 Optimum Source Resistance p. 357 Noise Factor of Cascaded Stages p. 360 p. 362 p. 364 Transistor Noise Factor p. 365 Vn-In for Transistors p. 367 Field-Effect Transistor Noise p. 368 FET Noise Factor p. 368 Vn-In Representation of FET Noise p. 370 Noise in Operational Amplifiers p. 370 Methods of Specifying Op-Amp Noise p. 373 Op-Amp Noise Factor p. 375 Summary p. 375 Problems p. 376 References p. 377 Further Reading p. 378 p. 379 Frequency Versus Time Domain p. 380 Analog Versus Digital Circuits p. 380 Digital Logic Noise p. 380 Internal Noise Sources p. 381 Digital Circuit Ground Noise p. 384 Minimizing Inductance p. 385 Mutual Inductance p. 386 Practical Digital Circuit Ground Systems p. 388 Loop Area p. 390 Ground Plane Current Distribution and Impedance p. 391 Reference Plane Current Distribution p. 392 Ground Plane Impedance p. 400 Ground Plane Voltage p. 408 End Effects p. 409 Digital Logic Current Flow p. 412 Microstrip Line p. 414 Stripline p. 415 Digital Circuit Current Flow Summary p. 418 Summary p. 419 Problems p. 420 References p. 421 Further Reading p. 422 EMC Applications p. 423 Digital Circuit Power Distribution p. 425 Power Supply Decoupling p. 425 Transient Power Supply Currents p. 426 Transient Load Current p. 428 Dynamic Internal Current p. 428 Fourier Spectrum of the Transient Current p. 429 Total Transient Current p. 431 Decoupling Capacitors p. 431 Effective Decoupling Strategies p. 436 Multiple Decoupling Capacitors p. 437 Multiple Capacitors of the Same Value p. 437 Multiple Capacitors of Two Different Values p. 440 Multiple Capacitors of Many Different Values p. 444 Target Impedance p. 445 Embedded PCB Capacitance p. 447 Power Supply Isolation p. 452 The Effect of Decoupling on Radiated Emissions p. 454 Decoupling Capacitor Type and Value p. 456 Decoupling Capacitor Placement and Mounting p. 457 Bulk Decoupling Capacitors p. 459 Power Entry Filters p. 460 Summary p. 461 Problems p. 461 References p. 463 Further Reading p. 463 Digital Circuit Radiation p. 464 Differential-Mode Radiation p. 465 Loop Area p. 468 Loop Current p. 468 Fourier Series p. 468 Radiated Emission Envelope p. 470 Controlling Differential-Mode Radiation p. 471 Board Layout p. 471 Canceling Loops p. 474 Dithered Clocks p. 475 Common-Mode Radiation p. 477 Controlling Common-Mode Radiation p. 480 Common-Mode Voltage p. 481 Cable Filtering and Shielding p. 482 Separate I/O Grounds p. 485 Dealing With Common-Mode Radiation Issues p. 488 Summary p. 488 Problems p. 489 References p. 490 Further Reading p. 491 Conducted Emissions p. 492 Power Line Impedance p. 492 Line Impedance Stabilization Network p. 494 Switched-Mode Power Supplies p. 495 Common-Mode Emissions p. 498 Differential-Mode Emissions p. 501 DC-to-DC Converters p. 509 Rectifier Diode Noise p. 509 Power-Line Filters p. 511 Common-Mode Filtering p. 512 Differential-Mode Filtering p. 512 Leakage Inductance p. 513 Filter Mounting p. 516 Power Supplies with Integral Power-Line Filters p. 519 High-Frequency Noise p. 520 Primary-to-Secondary Common-Mode Coupling p. 523 Frequency Dithering p. 524 Power Supply Instability p. 524 Magnetic Field Emissions p. 525 Variable Speed Motor Drives p. 528 Harmonic Suppression p. 536 Inductive Input Filters p. 538 Active Power Factor Correction p. 538 AC Line Reactors p. 539 Summary p. 541 Problems p. 542 References p. 544 Further Reading p. 544 RF and Transient Immunity p. 545 Performance Criteria p. 545 RF Immunity p. 546 The RF Environment p. 547 Audio Rectification p. 548 RFI Mitigation Techniques p. 549 Transient Immunity p. 557 Electrostatic Discharge p. 558 Electrical Fast Transient p. 558 Lightning Surge p. 559 Transient Suppression Networks p. 560 Signal Line Suppression p. 561 Protection of High-Speed Signal Lines p. 564 Power Line Transient Suppression p. 566 Hybrid Protection Network p. 570 Power Line Disturbances p. 572 Power Line Immunity Curve p. 573 Summary p. 575 Problems p. 576 References p. 578 Further Reading p. 579 Electrostatic Discharge p. 580 Static Generation p. 580 Inductive Charging p. 583 Energy Storage p. 585 Human Body Model p. 587 Static Discharge p. 589 Decay Time p. 590 ESD Protection in Equipment Design p. 592 Preventing ESD Entry p. 594 Metallic Enclosures p. 595 Input/Output Cable Treatment p. 599 Insulated Enclosures p. 604 Keyboards and Control Panels p. 607 Hardening Sensitive Circuits p. 608 ESD Grounding p. 608 Nongrounded Products p. 609 Field-Induced Upset p. 610 Inductive Coupling p. 611 Capacitive Coupling p. 611 Transient Hardened Software Design p. 612 Detecting Errors in Program Flow p. 613 Detecting Errors in Input/Output p. 614 Detecting Errors in Memory p. 616 Time Windows p. 617 Summary p. 617 Problems p. 619 References p. 620 Further Reading p. 621 PCB Layout and Stackup p. 622 General PCB Layout Considerations p. 622 Partitioning p. 622 Keep Out Zones p. 622 Critical Signals p. 623 System Clocks p. 624 PCB-to-Chassis Ground Connection p. 625 Return Path Discontinuities p. 626 Slots in Ground/Power Planes p. 627 Split Ground/Power Planes p. 628 Changing Reference Planes p. 630 Referencing the Top and Bottom of the Same Plane p. 633 Connectors p. 634 Ground Fill p. 634 PCB Layer Stackup p. 635 One- and Two-Layer Boards p. 636 Multilayer Boards p. 637 General PCB Design Procedure p. 653 Summary p. 655 Problems p. 657 References p. 658 Further Reading p. 658 Mixed-Signal PCB Layout p. 660 Split Ground Planes p. 660 Microstrip Ground Plane Current Distribution p. 662 Analog and Digital Ground Pins p. 665 When Should Split Ground Planes Be Used? p. 668 Mixed Signal ICs p. 669 Multi-Board Systems p. 671 High-Resolution A/D and D/A Converters p. 671 Stripline p. 673 Asymmetric Stripline p. 674 Isolated Analog and Digital Ground Planes p. 675 A/D and D/A Converter Support Circuitry p. 676 Sampling Clocks p. 676 Mixed-Signal Support Circuitry p. 678 Vertical Isolation p. 679 Mixed-Signal Power Distribution p. 681 Power Distribution p. 681 Decoupling p. 682 The IPC Problem p. 684 Summary p. 685 Problems p. 686 References p. 687 Further Reading p. 687 Precompliance EMC Measurements p. 688 Test Environment p. 689 Antennas Versus Probes p. 689 Common-Mode Currents on Cables p. 690 Test Procedure p. 693 Cautions p. 693 Near Field Measurements p. 694 Test Procedure p. 695 Cautions p. 696 Seams and Apertures in Enclosures p. 697 Noise Voltage Measurements p. 697 Balanced Differential Probe p. 698 DC to 1-GHz Probe p. 700 Cautions p. 700 Conducted Emission Testing p. 700 Test Procedure p. 702 Cautions p. 703 Separating C-M from D-M Noise p. 704 Spectrum Analyzers p. 707 Detector Functions p. 709 General Test Procedure p. 710 EMC Crash Cart p. 711 Mitigation Parts List p. 712 One-Meter Radiated Emission Measurements p. 713 Test Environment p. 713 Limits for 1-m Testing p. 713 Antennas for 1-m Testing p. 714 Precompliance Immunity Testing p. 717 Radiated Immunity p. 717 Conducted Immunity p. 720 Transient Immunity p. 721 Precompliance Power Quality Tests p. 723 Harmonics p. 724 Flicker p. 725 Margin p. 726 Radiated Emission Margin p. 726 Electrostatic Discharge Margin p. 727 Summary p. 728 Problems p. 729 References p. 730 Further Reading p. 731 Appendix p. 733 The Decibel p. 733 Properties of Logarithms p. 733 Using the Decibel for Other than Power Measurements p. 734 Power Loss or Negative Power Gain p. 736 Absolute Power Level p. 736 Summing Powers Expressed in Decibels p. 738 The Ten Best Ways to Maximize the Emission from Your Product p. 740 Multiple Reflections of Magnetic Fields in Thin Shields p. 743 Dipoles for Dummies p. 746 Basic Dipoles for Dummies p. 746 Intermediate Dipoles for Dummies p. 751 Advanced Dipoles for Dummies p. 756 Impedance of a Dipole p. 756 Dipole Resonance p. 756 Receiving Dipole p. 759 Theory of Images p. 759 Dipole Arrays p. 761 Very High-Frequency Dipoles p. 763 Summary p. 763 Further Reading p. 764 Partial Inductance p. 765 Inductance p. 765 Loop Inductance p. 767 Inductance of a Rectangular Loop p. 768 Partial Inductance p. 770 Partial Self-Inductance p. 771 Partial Mutual Inductance p. 773 Net Partial-Inductance p. 776 Partial Inductance Applications p. 776 Transmission Line Example p. 778 Ground Plane Inductance Measurement Test Setup p. 780 Inductance Notation p. 785 Summary p. 788 References p. 788 Further Reading p. 789 Answers to Problems p. 790 Index p. 825 Table of Contents provided by Ingram. All Rights Reserved.
기본정보
| ISBN | 9780470189306 ( 0470189304 ) |
|---|---|
| 발행(출시)일자 | 2009년 08월 01일 |
| 쪽수 | 880쪽 |
| 크기 |
163 * 229
* 43
mm
/ 1297 g
|
| 총권수 | 1권 |
| 언어 | 영어 |
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마이룸 > 주문관리 > 주문/배송내역 > 주문조회 > 반품/교환 신청, [1:1 상담 > 반품/교환/환불] 또는 고객센터 (1544-1900)
반품/교환방법
* 오픈마켓, 해외배송 주문, 기프트 주문시 [1:1 상담>반품/교환/환불] 또는 고객센터 (1544-1900) -
변심반품의 경우 수령 후 7일 이내,
반품/교환가능 기간
상품의 결함 및 계약내용과 다를 경우 문제점 발견 후 30일 이내 -
변심 혹은 구매착오로 인한 반품/교환은 반송료 고객 부담
반품/교환비용
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1) 소비자의 책임 있는 사유로 상품 등이 손실 또는 훼손된 경우
반품/교환 불가 사유
(단지 확인을 위한 포장 훼손은 제외)
2) 소비자의 사용, 포장 개봉에 의해 상품 등의 가치가 현저히 감소한 경우
예) 화장품, 식품, 가전제품(악세서리 포함) 등
3) 복제가 가능한 상품 등의 포장을 훼손한 경우
예) 음반/DVD/비디오, 소프트웨어, 만화책, 잡지, 영상 화보집
4) 소비자의 요청에 따라 개별적으로 주문 제작되는 상품의 경우 ((1)해외주문도서)
5) 디지털 컨텐츠인 ebook, 오디오북 등을 1회이상 ‘다운로드’를 받았거나 '바로보기'로 열람한 경우
6) 시간의 경과에 의해 재판매가 곤란한 정도로 가치가 현저히 감소한 경우
7) 전자상거래 등에서의 소비자보호에 관한 법률이 정하는 소비자 청약철회 제한 내용에 해당되는 경우
(1) 해외주문도서 : 이용자의 요청에 의한 개인주문상품으로 단순변심 및 착오로 인한 취소/교환/반품 시 ‘해외주문 반품/취소 수수료’ 고객 부담 (해외주문 반품/취소 수수료 : ①서양도서-판매정가의 12%, ②일본도서-판매정가의 7%를 적용) -
공급사(출판사) 재고 사정에 의해 품절/지연될 수 있으며, 품절 시 관련 사항에 대해서는 이메일과 문자로 안내드리겠습니다.
상품 품절
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1) 상품의 불량에 의한 교환, A/S, 환불, 품질보증 및 피해보상 등에 관한 사항은 소비자분쟁 해결 기준 (공정거래위원회 고시)에 준하여 처리됨
소비자 피해보상 환불 지연에 따른 배상
2) 대금 환불 및 환불지연에 따른 배상금 지급 조건, 절차 등은 전자상거래 등에서의 소비자 보호에 관한 법률에 따라 처리함
상품 설명에 반품/교환 관련한 안내가 있는 경우 그 내용을 우선으로 합니다. (업체 사정에 따라 달라질 수 있습니다.)
